Design, Simulation and Analysis of A Novel EBG Structure using Advanced Design System: Implementation and Related Issues
Abstract
Electromagnetic noise is a operational disturbances in the high frequency operational circuits. Parasitic filters are not efficient in the case of high frequency electronic circuits. In order to mitigate the noise level in such circuits, novel electromagnetic bandgap structure is designed, simulated and measured the noise level. Electronic design automation (EDA) tools help for these work and provide the designer to prevent the rework which leads to time and cost savings. It is essential to understand the capabilities of the tool. This paper gives the design and simulation procedure of the Novel L Bridge with double square embedded Electromagnetic Bandgap structure (EBG) for the frequency range 0 GHz to 10 GHz and the same structure is implemented in hardware and measured the results using R&S®ZVH Vector Network Analyzer. It is observed that the simulated and measured results are in good alignment with the result values.
Downloads
References
. J. Lau, C. Wong, J. Prince, and W. Nakayama, Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.
. G.-T. Lei, R. W. Techentin, and B. K. Gilbert, “High-frequency characterization of power/ground-plane structures,” IEEE Trans. Microw. Theory Tech., vol. 47, pp. 562–569, May 1999.
. S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures,” IEEE Trans. Electromagn.Compat., vol. 46, no. 4, pp. 580–587, Nov. 2004.
. R. Abhari and G. V. Eleftheriades, “Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure,” in Proc. IEEE MTT-S Int. Microwave Symp., vol. 1, Jun. 2002, pp. 493–496.
. T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microw.Wireless Compon.Lette., vol. 13, no. 1, pp. 21–23, Jan. 2003.
. R. Abhari and G. V. Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits,” IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629–1639, Jun. 2003.
. S. Shahparnia and O. M. Ramahi, “Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces,” Electron.Lett., vol. 40, no. 2, pp. 98–100, Jan. 2004.
. Y Uma Maheswari, A Amudha, L Ashokkumar, Y Dhayaneswaran, “Study on Electro Magnetic Interference and Compatibility Across Various Levels and Mitigation Technique using Software”, Technical Volume of 35th Indian Engineering Congress, December, 2020
. YahieaAlnaiemy1 , and Lajos Nagy 1 , 1 Budapest University of Technology and Economics, Budapest, Hungary, “Improved Antenna Gain and Efficiency Using Novel EBG Layer:, SoSE 2020 • IEEE 15th International Conference of System of Systems Engineering • June 2-4, 2020 Budapest, Hungary
. R. Gonzalo, P. D. Maagt, and M. Sorolla, “Enhanced patch antenna performance by suppressing surface waves using photonic-band substrates,” IEEE Trans. Microwave Theory Tech., vol. 47, no.11, pp. 2123- 2130, Nov. 1999.
. Li Yang; Mingyan Fan; Fanglu Chen; Jingzhao She; ZhengheFeng, “A novel compact electromagnetic-bandgap (EBG) structure and its applications for microwave circuits”, IEEE Transactions on Microwave Theory and Techniques Vol. 53, Issue: 1, Jan. 2005
. Y. Ko, K. Ito, J. Kudo, and T. Sudo, “Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane,” in Proc. Int. Symp. Electromagnetic Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 576 -579.
. Yuan-Yuan Zhang, Wen-Sheng Zhao✉, Qi Liu and Gaofeng Wang, “Novel electromagnetic bandgap structure for wideband suppression of simultaneous switching noise”, Electronics Letters 14th November 2019 Vol. 55 No. 23 pp. 1243–1245
. D. F. Sievenpiper, “High-impedance electromagnetic surfaces,” Ph.D. dissertation, Dept. Elect. Eng, Univ. California at Los Angeles, Los Angeles, CA, 1999.
. Bruce Archambeault,Sam Connor ,“Review of Printed-Circuit-Board Level EMI/EMC Issues and Tools”, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 52, NO. 2, MAY 2010
. Y. Uma Maheswari, A. Amudha, L. Ashok Kumar, K. Nagasaravanan, Mohana Sundaram, Y. Dhayaneswaran, “Simulation and Measurement of Conducted Emission in DC-DC convertor”, Conference Series, IOP Publishing - Journal of Physics: 1916 (2021) 012135, doi:10.1088/1742-6596/1916/1/012135.
. Cadence OrCAD Solutions. [Online]. Available: http://www.cadence. com/products/orcad/pages/default.aspx
. Ngspice. [Online]. Available: http://ngspice.sourceforge.net/
. KiCad. [Online]. Available: http://www.kicad-pcb.org
. H. Narayanan, Submodular functions and electrical networks. NorthHolland, 1997.
. C. W. Ho, A. E. Ruehli, and P. A. Brennan, “The modified nodal approach to network analysis,” IEEE Transactions on Circuits and Systems, vol. 22, pp. 504–509, Jun 1975. [15] E. J. Mastascusa, Computer-Assisted Network and System Analysis. John Wiley and Sons, 1987
. Wu, T. L., S. T. Chert, J. N. Huang, and Y. H. Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high speed digital PCB,” IEEE Trans. Electromagn. Compat., Vol. 46, No. 1, 33–45, Feb. 2004.
. Wu, T. L., H. H. Chuang, and T. K. Wang, “Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, 346–356, May 2010.
. Zhu, H.-R. and J.-F. Mao, “Localized planar EBG structure of CSRR for ultrawideband SSN mitigation and signal integrity improvement in mixed-signal systems,” IEEE Trans. Compon. Packag., Manuf. Technol., Vol. 3, No. 12, 2092–2100, Dec. 2013.
. Yang, F.-R., K.-P. Ma, Y. Qian, and T. Itoh, “A uniplanar compact photonic-bandgap (UC-PBG) structure and its applications for microwave circuits,” IEEE Transactions on Microwave Theory and Techniques, Vol. 47, No. 8, 1509–1514, Aug. 1999
. Li, L., B. Li, H.-H. Liu, and C.-H. Liang, “Locally resonant cavity cell model for electromagnetic bandgap structures,” IEEE Trans. Antennas Propag., Vol. 54, No. 1, 90–100, Jan. 2006.
. L. Peng, C. L. Ruan, and J. Xiong. “Compact EBG for multi-band applications” IEEE Transactions on Antennas and Propagation, vol. 60, pp. 4440-4444, 2012.
. X. L. Bao, G. Ruvio, and M. J. Ammann, “Low-profile dual-frequency GPS patch antenna enhanced with dual-band EBG structure,” Microw. Opt. Technol. Lett., vol. 49, no. 11, pp. 2630,-2634, Nov. 2007.
. T. Kamgaing, and O. M. Ramahi, “Multiband Electromagnetic-Bandgap Structures for Applications in Small FormFactor Multichip Module Packages,” IEEE Trans. Microw. Theory Tech., vol. 56, no. 10, pp. 2293-2300, Oct. 2008.
Copyright (c) 2021 Uma Maheswari Y, Amudha A, Ashok Kumar L
This work is licensed under a Creative Commons Attribution 4.0 International License.
I/We agree with the provision of the Bye-Law 118 of The Institution of Engineers (India) which states that copyright of each paper published in Institution Journal or Annual Technical Volume in full or in Abstract at its centres shall lie with the Institution.